Dry Ice Cleaning for Semiconductor Equipment

Dry Ice Semiconductor Cleaning

Dry ice is non-abrasive on metal, ceramics & many other substrates and is able to quickly remove all surface contaminants from even the most difficult areas.

 

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Dry Ice Semiconductor Cleaning

Clean more efficiently and reduce downtime and scrap rates

 

In semiconductor production, the processing equipment must be kept extremely clean in order to prevent product contamination. Traditional cleaning methods present challenges, including costly downtime, the use of chemicals and solvents, hazardous waste disposal and employee exposure to harmful chemicals.  Dry ice precision cleaning is an effective method used to decontaminate semiconductor manufacturing equipment. Our dry ice cleaning equipment can assist your semiconductor manufacturing process in a number of ways:

Cleaning the mold or die with dry ice after the molding process of microchips

 

 

  • Clean fixtures after plasma coating processes for microchips and PCB boards
  • Remove debris from laser-cut microchip edges
  • Clean alloy dies used to manufacture microchip carrier tapes
  • Clean molds and dies after microchip molding process
  • Clean PCB boards after welding

The environmentally responsible cleaning and surface preparation process is aggressive enough to quickly remove deposition and contamination without impacting the substrate material.  Dry ice is non-abrasive on metal, ceramics and many other substrates and is able to quickly remove all surface contaminants from even the most difficult areas of the processing equipment without creating a secondary waste stream.

 

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Cleaning Laser-Cut Microchip Edges in Semiconductor Fabrication

 

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Key Benefits

Benefits & Applications for Dry Ice Semicon Cleaning

  • Faster, more effective clean
  • Clean in-place without lengthy disassembly
  • Non-abrasive, non-flammable & non-conductive
  • Reduction or elimination of solvents/acids
  • Lower operating costs
  • Elimination of grit entrapment
  • Safer for employees
  • No secondary waste stream
  • Environmentally responsible

 

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Applications:

  • Wafers
  • Masks/Shields
  • Chemical Mechanical Polishing (CMP)
  • Vacuum pumps
  • Conformal coating removal off PCB
  • Wafer chamber tooling and components
  • Implanters
  • Ceramic support discs
  • Polycrystalline silicone reactors
  • Deposition tooling
  • Polishing tooling
  • +More

Benefits of Dry Ice Blasting

Always ensure that your manufacturing equipment produce top quality wafers and operate at peak efficiency

Dry ice cleaning is a more effective cleaning solution that provides the ability to clean in-place, without chemicals and without damage, which results in higher performing machinery, increased quality, reduced scrap rates and prolonged equipment life.

  • Non-abrasive Will not damage equipment
  • Reduce scrap rates
  • No secondary waste stream
  • Reduce cleaning time and resulting downtime
  • Reduce labor costs
  • Clean hot and online Minimal to no disassembly required
  • Eliminate manual cleaning with harmful chemical solvents
  • Environmentally sustainable
  • Reduce risk of unplanned production stoppages and costly repairs
  • Operationally safe Eliminate manual cleaning and exposure to unsafe conditions

We were impressed with its ability to clean the contaminants from the printer safely, which also minimized our need to use chemicals.


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